Trovaci a MECSPE 2025
28
C08
e-TECHINPOL® COPOLYMER SOLUTIONS FOR E&E sector
Pad 28 stand C08
Livello di innovazione:
Vantaggi del prodotto:
Easy processability with low pressure
Usable with small extruders
Final product ready to use
Recyclable
Solvent free
One component - 1K
Resistant and long-lasting
Excellent protection from external environment conditions
Settori di applicazione:
Electrical&Electronic
SIPOL® offers specific copolyester or copolyamide based hotmelts e‐TECHNIPOL® and e‐TECHNIPOL®PA for several applications and processing in the Electrical and Electronic markets.
Their easy processability at low pressure is suitable for over molding and potting processes.
e‐TECHNIPOL® and e‐TECHNIPOL®PA are characterized by high flexural modulus, superior resistance at low temperature and excellent adhesion to metals and polar plastic substrates.
Our wide range of hot melt grants easy 1K solution for an excellent protection of print circuit board (PCB) and electronic components from critical environment conditions as shock,
dust, humidity, chemicals, UV exposure and temperature.
For the Electrical segment, we also offer co-polyamide grades suitable for Heat Shrinkable
Tubing.